5
International Conferences
2020–26
Editions Span
1350+
Papers · 2024 Edition
IEEE
Technically Co-Sponsored
Upcoming International Conference on Advances in Computing, Communication and Materials (IEEE ICACCM) 2026 will be organized by Tulas University, Dehradun, on 19–20 November 2026. The conference will bring together researchers, academicians, industry experts, and professionals to share innovative research and explore emerging advancements in computing, communication, and materials. The conference is technically co-sponsored by the IEEE Uttar Pradesh Section (R10).
International Conference on Advances in Computing, Communication & Materials (IEEE ICACCM) 2020 was the inaugural jointly organized by Tula’s Institute, Dehradun, and Uttarakhand Technical University under TEQIP-III on 21–22 August 2020. The IEEE technically co-sponsored conference provided an international platform for researchers and industry professionals to present innovative work and exchange ideas in computing, communication, and materials. In the conference, total 260 research papers were received from across the world.
IEEE Uttar Pradesh Section International Conference on Electrical, Computer and Electronics (IEEE UPCON) 2021 was organized by Tula’s Institute, Dehradun on 10–12 December 2021. The conference provided a platform for researchers, academicians, and industry professionals to present innovative research and exchange ideas in electrical, computer, electronics, and related technologies.
International Conference on Advances in Computing, Communication and Materials (IEEE ICACCM) 2022 was organized at Tula’s Institute, Dehradun, on 10–11 November 2022. The IEEE technically co-sponsored conference provided a platform for researchers, academicians, and industry professionals to present innovative research and exchange ideas in computing, communication, and materials science. In this conference total, 320 research papers were submitted by researchers and academicians from across the world. The strong international participation highlighted the conference’s global reach and its significance as a platform for presenting innovative research and exchanging knowledge.
International Conference on Advances in Computing, Communication and Materials (IEEE ICACCM) 2024 was organized at Tula’s Institute, Dehradun, on 22–23 November 2024. The conference brought together researchers, academicians, and industry experts to present innovative research and exchange ideas in computing, communication, and materials. The conference received an overwhelming response, with 1350 research papers submitted by researchers and academicians from across the world. The wide participation reflected the conference’s international reach and its significance as a platform for sharing innovative research, emerging technologies, and scholarly contributions.
